The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Jun. 24, 2003
Applicants:

Ryo Taniguchi, Tsu, JP;

Yuji Takada, Kyoto, JP;

Masahiro Kodoh, Agei-gun, JP;

Masato Shinotani, Tsu, JP;

Hisanobu Tanaka, Kameyama, JP;

Atsushi Hironaka, Shijonawate, JP;

Inventors:

Ryo Taniguchi, Tsu, JP;

Yuji Takada, Kyoto, JP;

Masahiro Kodoh, Agei-gun, JP;

Masato Shinotani, Tsu, JP;

Hisanobu Tanaka, Kameyama, JP;

Atsushi Hironaka, Shijonawate, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.


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