The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Feb. 13, 2002
Applicants:

Ralf Nickolaus, Drensteinfurt, DE;

Heinz-peter Rink, Münster, DE;

Reinhold Clauss, Münster, DE;

Elisabeth Wessling, Emsdetten, DE;

Wilma Löcken, Haltern, DE;

Nicole Freitag, Münster, DE;

Dunja Mikolajetz, Ascheberg, DE;

Inventors:

Ralf Nickolaus, Drensteinfurt, DE;

Heinz-Peter Rink, Münster, DE;

Reinhold Clauss, Münster, DE;

Elisabeth Wessling, Emsdetten, DE;

Wilma Löcken, Haltern, DE;

Nicole Freitag, Münster, DE;

Dunja Mikolajetz, Ascheberg, DE;

Assignee:

BASF Coatings AG, Munster, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 283/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Aqueous primary dispersion, substantially or entirely free of volatile organic compounds, and comprising dispersed and/or emulsified, solid and/or liquid polymer particles and/or dispersed solid core/shell particles with a particle diameter≦500 nm, preparable by free-radical micro- or miniemulsion polymerization of at least one olefinically unsaturated monomer in the presence of at least one hydrophobic additive and of at least one oligomeric polyester with a number-average molecular weight of from 150 to 1 500 daltons, a hydroxyl number of from 100 to 1 000 mg KOH/g, and an acid number<20 mg KOH/g and also a process for preparing it and its use as a coating material, adhesive or sealing compound or to prepare a coating material, an adhesive or a sealing compound.


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