The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Aug. 18, 2003
Kenji Yoshida, Kawasaki, JP;
Hiroshi Nakazawa, Yokohama, JP;
Takeshi Fujimaki, Yokohama, JP;
Koji Miyamoto, Yokohama, JP;
Kenji Yoshida, Kawasaki, JP;
Hiroshi Nakazawa, Yokohama, JP;
Takeshi Fujimaki, Yokohama, JP;
Koji Miyamoto, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to each other. When the wirings are formed, a temperature of the wirings is held in a first temperature zone covering ±40° C. of a temperature at which a stress migration is most accelerated.