The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Nov. 07, 2003
Myung Sup Jung, Daejun-Shi, KR;
Yong Young Park, Daejun-Shi, KR;
Sung Kyung Jung, Suwon-Shi, KR;
Sang Yoon Yang, Suwon-Shi, KR;
Myung Sup Jung, Daejun-Shi, KR;
Yong Young Park, Daejun-Shi, KR;
Sung Kyung Jung, Suwon-Shi, KR;
Sang Yoon Yang, Suwon-Shi, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A soluble polyimide for a photosensitive polyimide precursor and a photosensitive polyimide precursor composition including the soluble polyimide, wherein the soluble polyimide contains hydroxyl and acetyl moieties and at least one reactive end-cap group at one or both ends of the polymer chain. The photosensitive polyimide precursor composition comprises the soluble polyimide, a polyamic acid containing at least one reactive end-cap group at one or both ends of the polymer chain, a photo acid generator (PAG) and optionally a dissolution inhibitor. Since the polyimide film of the present invention exhibits excellent thermal, electric and mechanical properties, it can be used as insulating films or protective films for various electronic devices. A pattern with a high resolution may be formed even on the polyamide film having a thickness of above 10 μm.