The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Dec. 10, 2001
Applicant:
Claude Bonet, Paris, FR;
Inventor:
Claude Bonet, Paris, FR;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux is deposited on the receiving pads, which then have metal balls are placed on them so as to form an assembly. The assembly is placed in an oven so as to heat the metal balls above their melting point. The balls are then cooled at a rate around 5° C./sec, so that the balls remain in their liquid state for a time period between 20 seconds to 65 seconds.