The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Apr. 22, 2004
Masafumi Hizukuri, Tosu, JP;
Seiji Takahashi, Munakata-gun, JP;
Masafumi Hizukuri, Tosu, JP;
Seiji Takahashi, Munakata-gun, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding toolabutting on the object to be bonded, and a pressing unit pressing the bonding tool to the object to be bonded. The bonding tool includes a transversely elongated horn, a vibratorapplying a longitudinal vibration to the hornin a first direction along the longitudinal direction of the horn a protruding partprotruding from the horn in a second direction substantially perpendicular to the first direction, a bonding operation partprovided in the end part of the protruding partto abut on the object to be bonded, and a heating unit inserted into a mounting hole provided in the horn. The heating unit is mounted into the mounting hole with a space maintained from the inner surface of the mounting hole.