The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Oct. 03, 2001
Lakhi N. Goenke, Ann Arbor, MI (US);
Charles Frederick Schweitzer, Northville, MI (US);
Jason Bullock, Legal Representative, Detroit, MI (US);
Shona Bullock, Legal Representative, Detroit, MI (US);
Mark D. Miller, Monroe, MI (US);
Jay Deavis Baker, Dearborn, MI (US);
Karen Lee Chiles, Farmington, MI (US);
Achyuta Achari, Canton, MI (US);
Lakhi N. Goenke, Ann Arbor, MI (US);
Charles Frederick Schweitzer, Northville, MI (US);
Jason Bullock, legal representative, Detroit, MI (US);
Shona Bullock, legal representative, Detroit, MI (US);
Mark D. Miller, Monroe, MI (US);
Jay DeAvis Baker, Dearborn, MI (US);
Karen Lee Chiles, Farmington, MI (US);
Achyuta Achari, Canton, MI (US);
Visteon Global Technologie, Inc., Van Bureu Township, MI (US);
Abstract
A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().