The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7154790 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 26, 2006

Filed:

Dec. 01, 2004
Applicants:

Sang-jib Han, Gyeonggi-do, KR;

Chang-hwan Lee, Gyeonggi-do, KR;

Inventors:

Sang-Jib Han, Gyeonggi-do, KR;

Chang-Hwan Lee, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 5/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Integrated circuit devices are provided including first and second chips and a common input/output pad electrically coupled to the first and second chips. At least one of the first and second chips includes a high voltage generator configured to receive an input voltage through the common input/output pad and generate a test voltage responsive to a test mode signal during a test mode of operation. The test voltage is higher than the input voltage. Related methods of operating integrated circuit devices and semiconductor devices are also provided.


Find Patent Forward Citations

Han, Sang-Jib. (2006). Multi-chip semiconductor packages and methods of operating the same (U.S. Patent No. 7154790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7154790

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