The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2006

Filed:

Nov. 12, 2004
Applicants:

Toshiyuki Nagasaku, Kokubunji, JP;

Hiroshi Kondoh, Fuchu, JP;

Hiroshi Shinoda, Tokyo, JP;

Inventors:

Toshiyuki Nagasaku, Kokubunji, JP;

Hiroshi Kondoh, Fuchu, JP;

Hiroshi Shinoda, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/00 (2006.01); G01S 13/00 (2006.01); G01S 13/93 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention intends to provide a sensor module suitable for miniaturization and reduction in costs, in the radar sensor that uses a millimeter or sub-millimeter wave signal of which frequency is more than 20 GHz. To accomplish this problem, the radar sensor is integrated into a one chip MMIC, in which an active circuit including an oscillator and a mixer is formed with an antenna on one semiconductor substrate. Further, the MMIC is sealed with a resin package. A dielectric lens is formed on the resin package over the antenna to attain a desired beamwidth. Thereby, the lens and the resin package can integrally be formed by a metal mold, thus reducing the cost.


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