The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2006

Filed:

Jul. 28, 2003
Applicants:

Mitsutaka Shimada, Kokubu, JP;

Yoshifumi Yamagata, Soraku-gun, JP;

Kazuhiro Otsuka, Soraku-gun, JP;

Masafumi Hisataka, Kokubu, JP;

Akira Oikawa, Kokubu, JP;

Michihiko Kuwahata, Kokubu, JP;

Masaru Yamano, Kokubu, JP;

Inventors:

Mitsutaka Shimada, Kokubu, JP;

Yoshifumi Yamagata, Soraku-gun, JP;

Kazuhiro Otsuka, Soraku-gun, JP;

Masafumi Hisataka, Kokubu, JP;

Akira Oikawa, Kokubu, JP;

Michihiko Kuwahata, Kokubu, JP;

Masaru Yamano, Kokubu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substratewith one principal surface thereof formed with an IDT electrodea connector electrodeand a periphery sealing electrodeand a base substrateformed with an electrodefor connection to the element connected to the connector electrodethrough a solder bump componentand a periphery sealing conductor filmjoined to the periphery sealing electrodethorough a solder sealing componentFor the solder bump componentand the solder sealing componenta Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrateis set in the range of 9–20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.


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