The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7154188 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 26, 2006

Filed:

Oct. 22, 2004
Applicant:

Yoshiharu Ogata, Sakata, JP;

Inventor:

Yoshiharu Ogata, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor chip includes a semiconductor substrate including first and second surfaces and a plurality of side surfaces, the first and second surfaces being parallel to each other and facing in opposite directions, the side surfaces connecting peripheries of the first and second surfaces. At least one of the side surfaces is an inclined surface with respect to the first and second surfaces, and a groove is formed in the inclined surface. The groove extends in a direction which intersects a plane parallel to the first and second surfaces and extends in a direction which intersects a plane which intersects the first and second surfaces at right angles.


Find Patent Forward Citations

Ogata, Yoshiharu. (2006). Semiconductor chip, semiconductor device, circuit board, and electronic instrument (U.S. Patent No. 7154188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7154188

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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