The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
May. 28, 2004
Osamu Ikeda, Oizumi-machi, JP;
Toshiyuki Ohkoda, Oizumi-machi, JP;
Osamu Ikeda, Oizumi-machi, JP;
Toshiyuki Ohkoda, Oizumi-machi, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface thereof and a cap arrayed wafer disposed with a plurality of sealing caps are attached to seal the MEMS devices in cavities between them. Then, a plurality of via-holes is provided penetrating through the semiconductor wafer to form embedded electrodes therein, and bump electrodes are formed thereon. After this procedure, this structure is cut along scribe lines to be divided into each of packages.