The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2006

Filed:

Jan. 18, 2001
Applicants:

Raymond Gales, Harlange, LU;

René Lanners, Bettborn, LU;

Michel Streel, Houffalize, BE;

Akitoshi Suzuki, Utsunomiya, JP;

Inventors:

Raymond Gales, Harlange, LU;

René Lanners, Bettborn, LU;

Michel Streel, Houffalize, BE;

Akitoshi Suzuki, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/20 (2006.01); C25C 1/12 (2006.01); C25D 7/04 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite copper foil () comprises a carrier foil () formed by electrodeposition onto a cathode, the carrier foil () having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer () is on the electrolyte side of said carrier foil (). A thin functional foil () formed by deposition of copper has a front side in contact with the release layer () and an opposite back side. The electrolyte side of the carrier foil () has a surface roughness Rz less than or equal to 3.5 μm. There is also presented a method for manufacturing such a composite copper foil.


Find Patent Forward Citations

Loading…