The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2006

Filed:

Apr. 13, 2006
Applicants:

Roderick D. Herdman, Staffordshire, GB;

Trevor Pearson, West Midlands, GB;

Inventors:

Roderick D. Herdman, Staffordshire, GB;

Trevor Pearson, West Midlands, GB;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 7/00 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d) an organosulphur compound having the formula R—S—R'—SOXor X—OS—R′—S—R—S—R′—SO—X, wherein R is alkyl, hydroxyalkyl or alkyl ether, R′ is a C–Calkyl group, and Xis a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.


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