The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2006

Filed:

Mar. 14, 2003
Applicants:

Hiroshi Morita, Hitachi, JP;

Kazuhide Tanaka, Hitachi, JP;

Yasuo Suzuki, Takahagi, JP;

Michiya Okada, Mito, JP;

Inventors:

Hiroshi Morita, Hitachi, JP;

Kazuhide Tanaka, Hitachi, JP;

Yasuo Suzuki, Takahagi, JP;

Michiya Okada, Mito, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01B 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of producing an electrical connection structure between at least two superconducting lines. The method comprises adding metal powder or alloy powder to a superconducting material comprising magnesium diboride, intervening the superconducting material between at least two superconducting lines, and heating said superconducting lines and said superconducting material to a temperature lower than the melting point of said superconducting material prior to the addition of said metal powder or alloy powder thereto, but higher than the melting point of said metal powder or alloy powder.


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