The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2006

Filed:

Dec. 22, 2003
Applicants:

Bryan D. Haynes, Cumming, GA (US);

Michael Charles Cook, Marietta, GA (US);

Inventors:

Bryan D. Haynes, Cumming, GA (US);

Michael Charles Cook, Marietta, GA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
D01D 5/088 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die tip adapted for extruding a plurality of meltblown multicomponent filaments that includes at least two series of conduits that extend and converge in to the interior of the die tip to convey a multicomponent thermoplastic structure in to the interior of the die tip to a series of capillaries that extend to a series of die opening for extruding multicomponent filaments is provided.


Find Patent Forward Citations

Haynes, Bryan. (2006). Die for producing meltblown multicomponent fibers and meltblown nonwoven fabrics (U.S. Patent No. 7150616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7150616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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