The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
Oct. 29, 2004
Simon Dodd, Philomath, OR (US);
S. Jonathan Wang, Albany, OR (US);
Dennis W. Tom, Corvallis, OR (US);
Frank R. Bryant, Denton, TX (US);
Terry E. Mcmahon, Albany, OR (US);
Richard Todd Miller, Corvallis, OR (US);
Gregory T. Hindman, Albany, OR (US);
Simon Dodd, Philomath, OR (US);
S. Jonathan Wang, Albany, OR (US);
Dennis W. Tom, Corvallis, OR (US);
Frank R. Bryant, Denton, TX (US);
Terry E. McMahon, Albany, OR (US);
Richard Todd Miller, Corvallis, OR (US);
Gregory T. Hindman, Albany, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A fluid ejection device including: a substrate having a first surface having an non-doped region; a first insulative material disposed on a portion of the first surface, the first insulative material having a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantial free of the second insulative material and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the non-doped region on the substrate.