The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2006

Filed:

Apr. 30, 2004
Applicants:

Paul N. Becker, San Carlos, CA (US);

Sirikhit Maniraj, East Palo Alto, CA (US);

Martin Pineda, Fremont, CA (US);

Anthony Vranicar, Santa Clara, CA (US);

Francis M. Yankello, Union City, CA (US);

Frank Wasilewski, Redwood City, CA (US);

Inventors:

Paul N. Becker, San Carlos, CA (US);

Sirikhit Maniraj, East Palo Alto, CA (US);

Martin Pineda, Fremont, CA (US);

Anthony Vranicar, Santa Clara, CA (US);

Francis M. Yankello, Union City, CA (US);

Frank Wasilewski, Redwood City, CA (US);

Assignee:

Tyco Electronics Corporation, Middletown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit protection device () suitable for surface mounting on a substrate (). The device has a laminar PTC resistive element () which is composed of a conductive polymer composition and is positioned between first and second electrodes (). Attached to the first electrode is a first electrical terminal () containing an electrically conductive material which has a first attachment portion () connected to a first flexible portion () by means of a first connection portion (). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot () and a solid hinge portion (). When the device is mounted on a substrate by means of a mounting component () extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.


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