The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Aug. 28, 2003
Young-hee Song, Kyunggi-do, KR;
Il-heung Choi, Kyunggi-Do, KR;
Jeong-jin Kim, Chungcheongnam-Do, KR;
Hae-jeong Sohn, Kyunggi-Do, KR;
Chung-woo Lee, Kyunggi-Do, KR;
Young-Hee Song, Kyunggi-do, KR;
Il-Heung Choi, Kyunggi-Do, KR;
Jeong-Jin Kim, Chungcheongnam-Do, KR;
Hae-Jeong Sohn, Kyunggi-Do, KR;
Chung-Woo Lee, Kyunggi-Do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.