The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Aug. 25, 2003
Prashant K. Singh, Eden Praire, MN (US);
Prashant K. Singh, Eden Praire, MN (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
The present invention is an apparatus and system for reducing bondpad capacitance of an integrated circuit. Circuitry of the present invention may produce a negative capacitance approximately equal in magnitude to the capacitance associated with the bondpad and thereby effectively eliminate the bondpad capacitance. Values of the components of the circuitry may be selectively and independently chosen to synthesize a variable range of negative capacitance and thus produce a negative capacitance approximately equal in magnitude to a unique capacitance associated with the bondpad of a variety of integrated circuits.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile