The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Mar. 07, 2003
Pyoung Wan Kim, Cheonan, KR;
Sang Hyeop Lee, Cheonan, KR;
Chang Cheol Lee, Cheonan, KR;
Gun Ah Lee, Suwon, KR;
Pyoung Wan Kim, Cheonan, KR;
Sang Hyeop Lee, Cheonan, KR;
Chang Cheol Lee, Cheonan, KR;
Gun Ah Lee, Suwon, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.