The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Feb. 08, 1999
Keiji Shigesada, Kanagawa, JP;
Seiichi Watanabe, Kanagawa, JP;
Naoyoshi Chino, Kanagawa, JP;
Fuji Photo Film Co., Ltd., Kanagawa, JP;
Abstract
An injection molding method and an injection mold used therefor are provided, in which a molded product free from burrs, whitening and gate marks can be obtained with a simple structure mold, and it can adequately serve the needs for multicavity molding as well. In the injection molding method, molten resin material is introduced and charged into a resin reservoir and a molding cavity of an injection mold, where a depth of the resin reservoir is larger than a thickness of a communicating portion. A cut punch is moved, when a portion of the resin material in the resin reservoir is still molten, to push the molten resin in the resin reservoir back from a gate into a runner so that the cut punch not only closes the communicating portion but also cuts a resin solidified portion in the resin reservoir away from a resin molded product in the molding cavity at the communicating portion.