The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2006

Filed:

Oct. 19, 2005
Applicants:

Romi Mayder, San Jose, CA (US);

John W. Andberg, Santa Cruz, CA (US);

Don Chiu, Sunnyvale, CA (US);

Noriyuki Sugihara, Campbell, CA (US);

Inventors:

Romi Mayder, San Jose, CA (US);

John W. Andberg, Santa Cruz, CA (US);

Don Chiu, Sunnyvale, CA (US);

Noriyuki Sugihara, Campbell, CA (US);

Assignee:

Verigy IPco, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.


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