The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Nov. 24, 2004
Masaya Kawano, Kanagawa, JP;
Satoshi Matsui, Kanagawa, JP;
Masaya Kawano, Kanagawa, JP;
Satoshi Matsui, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
The present invention is aimed at bonding a lower chip and an upper chip through bumps in a highly reliable manner, while ensuring a sufficient area for an external connection terminal region, by offsetting the upper chip to the lower chip. The substratehas bumpsarranged on one surface thereof, and has a first chipmounted on the other surface thereof. A second chipis bonded to the first chipthrough bumpswhile offsetting the second chipto the first chipin parallel. In the bonded state of the first chipand the second chipa part of the first chipand a part of the second chipare overlapped without aligning the centers of the both. The center of gravity of the second chipfalls inside a region surrounded by the outermost bumps between the first chipand the second chip