The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Apr. 28, 2003
Takashi Kunimatsu, Osaka, JP;
Minoru Fukui, Osaka, JP;
Takashi Kunimatsu, Osaka, JP;
Minoru Fukui, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The semiconductor device of this invention includes a first die pad down-set away from boundary portions between inner lead portions and outer lead portions; a first semiconductor chip mounted on the first die pad; a chip-shaped electronic component with a small thickness mounted on a second die pad formed by increasing the width of at least one of the inner lead portions; metal wires; leads each having an inner lead portion and an outer lead portion; and an encapsulation resin part for encapsulating the die pads, the semiconductor chip, the chip-shaped electronic component, the inner lead portions and the metal wires.