The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Dec. 31, 2003
Applicant:
Kazuhide Abe, Tokyo, JP;
Inventor:
Kazuhide Abe, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Cu is nitrided to form a nitride of Cuon a Cu wiring layer. A diffusion base material layerused as a diffusion source and a barrier metal layer, which are interdiffused with Cu, are formed on the nitride of Cu. With heat treatment, the Cu wiring layerand the diffusion base material layerare interdiffused to form an alloy layer of Cubetween the Cu wiring layerand the barrier metal layer
Abe, Kazuhide. (2006). Method of forming copper wire (U.S. Patent No. 7144812). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7144812
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile