The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Apr. 01, 2005
Dzintra Hilton, Legal Representative, Queensland, AU;
Mark L. Diorio, Cupertino, CA (US);
Dzintra Hilton, legal representative, Queensland, AU;
Mark L. DiOrio, Cupertino, CA (US);
Celerity Research Pte. Ltd., Singapore, SG;
Abstract
Packaging processes and structures provide thin-film interconnects for high performance signal transmission of high frequency signals. The thin-film interconnects can be formed on a carrier that is at least partly removed for formation of terminals such as a BGA connected to the thin-film interconnects. Removal of the carrier can leave a frame for handling of the thin-film interconnects during subsequent processing. The thin film interconnects can be used to route signals to external terminals, between dies, or between functional units within a die. This allows the dies to contain fewer routing layers and allows configuration of a device such as an ASIC during packaging. A coarser pitch interconnect structure can be fabricated on the carrier using different technology for power and ground management and/or in a core that attaches to the thin-film package structure.