The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jan. 03, 2003
Applicants:
Toshiaki Oku, Izumi, JP;
Hiroyuki Suga, Osaka, JP;
Inventors:
Toshiaki Oku, Izumi, JP;
Hiroyuki Suga, Osaka, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/46 (2006.01); B29B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating a molded resinous part with a metal distributed in a surface thereof comprising: kneading a low-melting metal and a resin having a curing temperature lower than a solidification point of the low-melting metal in a molten state; and injection-molding the resulting kneaded mixture into a mold whose temperature is set to a temperature equal to or lower than the solidification point of the low-melting metal and higher than the curing temperature of the resin, thereby obtaining a molded resinous part comprising the resin as a core and the low-melting metal in a surface thereof.