The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jun. 11, 2003
Makoto Tanaka, Obu, JP;
Kazuoki Matsugatani, Kariya, JP;
Makoto Tanaka, Obu, JP;
Kazuoki Matsugatani, Kariya, JP;
Denso Corporation, Kariya, JP;
Abstract
A compact package whose inner walls can be located near a radio frequency circuit without changing the characteristics of the radio frequency circuit has a planar circuit on the bottom of the package, which is enclosed with metal walls. A high impedance plate is formed in two dimensions on the metal plate of a lid. The high impedance plate has a dielectric sheet on which is formed a conductor sheet on which is formed a two-dimensional periodic array of right hexagonal metal patches. The high impedance plate blocks surface propagation of electromagnetic waves in a certain frequency band (band gap). The operating frequency of the planar circuit is set within the band gap, so that the lid and the planar circuit can be put close to each other with no change in the operation characteristics of the planar circuit.