The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2006

Filed:

Dec. 18, 2003
Applicants:

Shinya Miyaji, Yokohama, JP;

Shinji Saito, Yokohama, JP;

Inventors:

Shinya Miyaji, Yokohama, JP;

Shinji Saito, Yokohama, JP;

Assignee:

NHK Spring Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to an electrostatic chuck in which unification of a dielectric layer and a heating and cooling flange is omitted, whereby production cost can be decreased, resulting in having adequate corrosion resistance especially for high temperature processes for semiconductor. The electrostatic chuck comprises a stage and a dielectric layer formed on an upper surface of the stage by thermal spraying, and the dielectric layer is made of magnesium oxide.


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