The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2006

Filed:

Feb. 03, 2005
Applicants:

Hidetomi Majima, Niigata-ken, JP;

Michiaki Moroe, Niigata-ken, JP;

Inventors:

Hidetomi Majima, Niigata-ken, JP;

Michiaki Moroe, Niigata-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal head includes a head substrate having a common electrode and individual electrodes connected to exothermic bodies and a driving IC substrate having driving ICs controlling electrification of the individual electrodes and IC electrode pads arranged substantially in parallel with and at a smaller pitch (at most 60 μm) than the exothermic bodies. The individual electrodes and the corresponding IC electrode pads are bonded together with connection wire having a diameter of at most 23 μm. The connection wire includes a connection portion with a width larger than the wire diameter that is connected to the individual electrodes or the IC electrode pads and an upstanding portion raised from the connection portion at a predetermined angle. The surface area of the connection portion is not less than 0.0015 mmand the sectional area of the upstanding portion is not less than 0.00025 mm.


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