The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2006

Filed:

Mar. 31, 2004
Applicants:

Georg Wittmann, Herzogenaurach, DE;

Jan Birnstock, Dresden, DE;

Ralph Pätzold, Roth, DE;

Karsten Heuser, Erlangen, DE;

Debora Henseler, Erlangen, DE;

Inventors:

Georg Wittmann, Herzogenaurach, DE;

Jan Birnstock, Dresden, DE;

Ralph Pätzold, Roth, DE;

Karsten Heuser, Erlangen, DE;

Debora Henseler, Erlangen, DE;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 1/62 (2006.01); H01J 63/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A planar electronic component has a functional layer with an optoelectronic or a circuit configuration between a substrate layer and a covering layer. A sealing frame or sealing ring is disposed between the substrate layer and the covering layer and connected to them by an integral joint surrounding the functional layer. The seal very largely protects the functional layer against hazardous external influences, in particular against moisture and oxygen. A mechanical connector, whose adhesive characteristics are matched to the materials of the covering layer and of the substrate, is provided in addition to the sealing ring. The connector fixes the substrate and covering layers mechanically with respect to one another, and may reduce the risk of partial or complete detachment in the event of deformation of the electronic component, in particular as a result of thermal expansion and/or mechanical loading.


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