The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Oct. 27, 2003
Satoshi Idemura, Sakura, JP;
Masao Yamada, Ichihara, JP;
Koichi Fujimoto, Chiba, JP;
Katsuji Takahashi, Sakura, JP;
Satoshi Idemura, Sakura, JP;
Masao Yamada, Ichihara, JP;
Koichi Fujimoto, Chiba, JP;
Katsuji Takahashi, Sakura, JP;
Dainippon Ink and Chemicals, Inc., Tokyo, JP;
Abstract
An epoxy resin cured article has a high glass transition temperature and low dissipation factor. An epoxy resin composition from which the cured article can be having excellent solubility in solvents is used to produce the cured articles. A polyester as a curing agent of an epoxy resin composition having an aromatic polyhydroxy coumpound residue including an aryloxycarbonyl group at the molecule of the terminal, an aromatic polyvalent hydrocarbon group residue, and bulky structure, is used. Since the curing agent behaves as a polyfunctional curing agent, a cured article produced therefrom has a high crosslink density. Since highly polar hydroxyl groups are not formed during curing, a cured article has high glass transition temperature and a low dissipation factor. The cured article does not release low molecular weight carboxylic acids though hydrolysis of ester bonds at crosslinked bonds. Since the polyester has a bulky structure, the crystallization of the molecular chain is prevented and the solubility of the epoxy resin composition containing the polyester is excellent.