The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Apr. 14, 2004
Yusuke Igarashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Takeshi Nakamura, Gunma, JP;
Yusuke Igarashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Takeshi Nakamura, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A method for fabricating a circuit device includes preparing a laminating sheet comprising a conductive film, insulation resin formed on the surface of the conductive film, and a first conductive path layer formed on the surface of the insulation resin. Semiconductor elements are adhered and fixed on the first conductive path layer. A sealing resin is provided as an overcoat to the first conductive path layer and the semiconductor elements. The method includes forming a second conductive path layer by etching the conductive film into a predetermined pattern and forming an external electrode at predetermined points of the second conductive path layer.