The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jul. 01, 2004
Applicants:
Ganesh Vetrivel Periasamy, Singapore, SG;
Vaidyanathan Kripesh, Singapore, SG;
Inventors:
Ganesh Vetrivel Periasamy, Singapore, SG;
Vaidyanathan Kripesh, Singapore, SG;
Assignee:
Agency for Science Technology and Research, Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
In an improved method for bumped wafer thinning, a wafer is provided having a front side and a back side wherein contact pads are formed on the top surface. A dry film is formed on the front side of the wafer and openings are provided in the dry film to the contact pads. Interconnections, such as solder bumps, are formed within the openings on the contact pads. A back grind tape or carrier is attached to the dry film and overlying the interconnections. Thereafter, the wafer is thinned from the back side of the wafer.