The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Mar. 04, 2004
Kee-bong Choi, Daejeon, KR;
Jae-jong Lee, Daejeon, KR;
Kee-Bong Choi, Daejeon, KR;
Jae-Jong Lee, Daejeon, KR;
Korea Institute of Machinery & Materials, Daejeon, KR;
Abstract
A self-alignment stage for compression-forming machines, which self-aligns an upper surface of a lower mold seated on an inner frame, thus compensating for a relative pose error of the lower mold with respect to an upper mold when the material is compression-formed between the upper mold and the lower mold. The self-alignment stage for the compression-forming machines, includes an outer frame comprising a body having a space therein, a plurality of outer connectors protruding from a side surface of the body of the outer frame so as to support the body on a support base of a compression-forming machine, and the inner frame placed in the space of the outer frame such that the inner frame executes a horizontal translational motion and a rotational motion with respect to the outer frame. The self-alignment stage further includes a plurality of inner connectors to connect the inner frame to the outer frame while allowing the inner frame to execute the horizontal translational motion and the rotational motion with respect to the outer frame. The lower mold is seated on the inner frame is self-aligned by elasticity of the inner and outer connectors, so that the upper surface of the lower mold is in parallel surface contact with a lower surface of the upper mold when the material is compression-formed by the upper mold.