The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Dec. 08, 2004
Applicants:
Kazuyuki Aiba, Kawasaki, JP;
Akira Takashima, Kawasaki, JP;
Kaname Ozawa, Kawasaki, JP;
Tetsuya Hiraoka, Kawasaki, JP;
Takaaki Suzuki, Kawasaki, JP;
Yasurou Matsuzaki, Kawasaki, JP;
Inventors:
Kazuyuki Aiba, Kawasaki, JP;
Akira Takashima, Kawasaki, JP;
Kaname Ozawa, Kawasaki, JP;
Tetsuya Hiraoka, Kawasaki, JP;
Takaaki Suzuki, Kawasaki, JP;
Yasurou Matsuzaki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 29/06 (2006.01); H01L 23/28 (2006.01); H01L 29/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.