The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Jun. 24, 2003
Yoshiyuki Arai, Kyoto, JP;
Takashi Yui, Shiga, JP;
Yoshiaki Takeoka, Kyoto, JP;
Fumito Itou, Osaka, JP;
Kouichi Yamauchi, Osaka, JP;
Yasutake Yaguchi, Osaka, JP;
Yoshiyuki Arai, Kyoto, JP;
Takashi Yui, Shiga, JP;
Yoshiaki Takeoka, Kyoto, JP;
Fumito Itou, Osaka, JP;
Kouichi Yamauchi, Osaka, JP;
Yasutake Yaguchi, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.