The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2006

Filed:

Sep. 28, 2001
Applicants:

Yumiko Oyasato, Kanagawa-ken, JP;

Cao Minh Thai, Kanagawa-ken, JP;

Shioko Saya, Kanagawa-ken, JP;

Shinetsu Fujieda, Kanagawa-ken, JP;

Tomiaki Furuya, Kanagawa-ken, JP;

Inventors:

Yumiko Oyasato, Kanagawa-ken, JP;

Cao Minh Thai, Kanagawa-ken, JP;

Shioko Saya, Kanagawa-ken, JP;

Shinetsu Fujieda, Kanagawa-ken, JP;

Tomiaki Furuya, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 11/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of decomposing a thermosetting resin by a decomposer comprising the steps of: pre-heating the thermosetting resin up to a pre-heating temperature T; kneading the pre-heated thermosetting resin together with a decomposer, and concurrently heating a mixture comprising the thermosetting resin and the decomposer up to a kneading temperature T, thereby allowing a reaction to take place between the decomposer and the thermosetting resin to obtain a kneaded matter wherein the decomposer becomes consumed; and heating the kneaded matter to a maximum temperature Tto thereby decompose the thermosetting resin; wherein the preheating temperature Tis not higher than the boiling temperature of the decomposer; the kneading temperature Tis not lower than the pre-heating temperature Tbut is lower than the thermal decomposition temperature of the thermosetting resin; the maximum temperature Tis lower than the decomposition temperature of the thermosetting resin; and the pre-heating of the thermosetting resin is performed under the following conditions of temperature Tand time t:100° C.≦T0<260° C.0.5 min≦t≦7 min.


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