The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2006
Filed:
Mar. 03, 2004
Yuji Nishitani, Kanagawa, JP;
Tsuyoshi Ogawa, Kanagawa, JP;
Hiroshi Asami, Shizuoka, JP;
Akihiko Okubora, Kanagawa, JP;
Yuji Nishitani, Kanagawa, JP;
Tsuyoshi Ogawa, Kanagawa, JP;
Hiroshi Asami, Shizuoka, JP;
Akihiko Okubora, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A circuit substrate device composed of a circuit unitand a multi-layer wiring substratein which a pattern conductor of the circuit unitmay be prevented from being warped or inundated. The circuit substrate device includes a circuit unithaving a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substratehaving a connecting terminal portionexposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrateso that the pattern conductor is connected to the connecting terminal portion. The dummy substrate is then removed to give a structure comprised of the circuit unitformed on the multi-layer wiring substrate. The pattern conductor of the circuit unitis freed of warping or inundations along the direction of thickness of the circuit unit