The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2006

Filed:

Feb. 14, 2003
Applicants:

Chul Ho Ham, Seongnam-shi, KR;

Chan Ho Park, Chonan-shi, KR;

Woo Young Lim, Seoul, KR;

Jae Bong Seo, Seongnam-shi, KR;

Inventors:

Chul Ho Ham, Seongnam-shi, KR;

Chan Ho Park, Chonan-shi, KR;

Woo Young Lim, Seoul, KR;

Jae Bong Seo, Seongnam-shi, KR;

Assignee:

Mirae Corporation, Chungchengnam-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 73/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.


Find Patent Forward Citations

Loading…