The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Jul. 23, 2004
Applicants:
Hsiao-lin Kuo, Hsinchu, TW;
Ching-chien Chen, Hsinchu, TW;
Kwo-fang Ku, Taiping, TW;
Yu-chin Hsu, Hsinchu, TW;
Inventors:
Hsiao-Lin Kuo, Hsinchu, TW;
Ching-Chien Chen, Hsinchu, TW;
Kwo-Fang Ku, Taiping, TW;
Yu-Chin Hsu, Hsinchu, TW;
Assignee:
Inpaq Technology Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
An insulated structure of a chip array component and fabrication method of the same, the element is fabricated by enclosing its main body with a dense layer of high surface insulation resistance material, and then exposing the portions of the main body where terminal electrodes are to be formed by removing the dense layer of high surface insulation resistance material by employing sand blasting, laser trimming, grinding, or etching process.