The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Dec. 02, 2004
Ying-chang Houng, Guansi Township, Hsinchu County, TW;
Hong-ching Lin, Kaohsiung, TW;
Chi-jen Shih, Fongshan, TW;
Shao-ju Shih, Taipei, TW;
Ying-Chang Houng, Guansi Township, Hsinchu County, TW;
Hong-Ching Lin, Kaohsiung, TW;
Chi-Jen Shih, Fongshan, TW;
Shao-Ju Shih, Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.)