The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Apr. 23, 2004
Viraj A. Patwardhan, Sunnyvale, CA (US);
Lian Hee Tan, Batu Berendam, MY;
Nikhil Vishwanath Kelkar, San Jose, CA (US);
Viraj A. Patwardhan, Sunnyvale, CA (US);
Lian Hee Tan, Batu Berendam, MY;
Nikhil Vishwanath Kelkar, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to the back surface of a wafer. The backcoat layer is cured or set such that the backcoat layer is affixed to the back surface of the wafer. Thereafter, the mount layer of the backcoat/mount tape is removed while leaving the backcoat layer affixed to the back surface of the integrated circuit devices. In some embodiments, the mount layer includes an ultraviolet (UV) sensitive adhesive material that releases when exposed to UV light. The described arrangements can be used to form integrated circuits having very thin protective backcoatings. By way of example, opaque protective films having thickness in the range of 5 to 50 microns are readily obtainable.