The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Nov. 21, 2003
Yuji Takaoka, Kanagawa, JP;
Yukihiro Kamide, Kanagawa, JP;
Teruo Hirayama, Kanagawa, JP;
Masaki Hatano, Kanagawa, JP;
Yuji Takaoka, Kanagawa, JP;
Yukihiro Kamide, Kanagawa, JP;
Teruo Hirayama, Kanagawa, JP;
Masaki Hatano, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A semiconductor device of MCM type allowing high-density assembly and a process of fabricating the same is provided. There are provided semiconductor chips mounted on a supporting substrate and incrusted in an insulation film on the supporting substrate and wiring formed in the insulation film so as to connect to each semiconductor chip through connection holes provided in the insulation film. Then, an interlayer dielectric covers such wiring that is connected to an upper layer wiring, through connection holes provided in such interlayer dielectric. In addition, an upper layer insulation film covers the upper layer wiring, and an electrode, connected to such upper layer wiring through another connection hole, is provided on such upper layer insulation film.