The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2006

Filed:

Nov. 14, 2002
Applicants:

Minoru Matsuo, Kanagawa, JP;

Hideki Komatsu, Kanagawa, JP;

Akiko Tanaka, Kanagawa, JP;

Yuichi Jibiki, Kanagawa, JP;

Inventors:

Minoru Matsuo, Kanagawa, JP;

Hideki Komatsu, Kanagawa, JP;

Akiko Tanaka, Kanagawa, JP;

Yuichi Jibiki, Kanagawa, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); B32B 3/00 (2006.01); B32B 7/14 (2006.01); G03G 15/00 (2006.01); G03G 13/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A film is made of an insulating matrix resin and an electroconductive material, in which the electroconductive material is dispersed in the insulating matrix resin in such a manner that a surface resistivity of A [Ω] of the film and a volume resistivity of B [Ω·cm] of the film in the direction of a thickness thereof normal to the surface of the film satisfy a relationship of: A>B, and when the film has a thickness of T [cm], the electroconductive material is dispersed in the insulating matrix resin in such a manner that the surface resistivity of A [Ω] of the film and the volume resistivity of B [Ω·cm] of the film satisfy a relationship of: A[Ω]×T[cm]>B[Ω·cm]. This film can be prepared by a centrifugal molding method.


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