The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2006

Filed:

Dec. 12, 2002
Applicant:

Rui DE Oliveira, Arenthon, FR;

Inventor:

Rui De Oliveira, Arenthon, FR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention concerns a method for making a multilayer module with high-density printed circuits, which consists in: preparing a substrate () with double-sided printed circuits () whereon is bonded a single-sided plated () polyimide () additional layer using a polymerisable two-phase epoxy liquid (); after selectively etching () the metal, carrying out anisotropic chemical drilling of micro-holes () through the polyimide film () by immersing the latter in a static bath of a potassium-added aqueous ethylene-diamine solution at least at 25° C.; rinsing the adhesive () by spraying a solvent in the base of the micro-holes (); plating the micro-holes (); and selectively etching the outer metallic film () to form therein printed circuits () including the plated micro-holes ().


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