The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Mar. 30, 2004
Bunji Moriya, Tokyo, JP;
Seiichi Tajima, Tokyo, JP;
Fumikachi Kurosawa, Tokyo, JP;
Shinichiro Hayashi, Tokyo, JP;
Bunji Moriya, Tokyo, JP;
Seiichi Tajima, Tokyo, JP;
Fumikachi Kurosawa, Tokyo, JP;
Shinichiro Hayashi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.