The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Feb. 18, 2005
Peter A. Stenger, Woodbine, MD (US);
Fred C. Kuss, Elkridge, MD (US);
Kevin Lacour, Laurel, MD (US);
Craig Heffner, Ellicott City, MD (US);
Robert Sisk, Annapolis, MD (US);
Carl D. Wise, Severna Park, MD (US);
Joseph Paquin, Columbia, MD (US);
Tujuana Hinton, Baltimore, MD (US);
Andrew Walters, Elkridge, MD (US);
David Krafcsik, Crownsville, MD (US);
Brian T. Mcmonagle, Woodstock, MD (US);
Steven D. Block, Pikesville, MD (US);
Steven S. Handley, Severna Park, MD (US);
Peter A. Stenger, Woodbine, MD (US);
Fred C. Kuss, Elkridge, MD (US);
Kevin LaCour, Laurel, MD (US);
Craig Heffner, Ellicott City, MD (US);
Robert Sisk, Annapolis, MD (US);
Carl D. Wise, Severna Park, MD (US);
Joseph Paquin, Columbia, MD (US);
Tujuana Hinton, Baltimore, MD (US);
Andrew Walters, Elkridge, MD (US);
David Krafcsik, Crownsville, MD (US);
Brian T. McMonagle, Woodstock, MD (US);
Steven D. Block, Pikesville, MD (US);
Steven S. Handley, Severna Park, MD (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports. Cooling of the various components is achieved by a pair of planar forced air heat sink members which are located on either side of the array of beam control tiles. DC power and control of the T/R cells is provided by a printed circuit wiring board assembly located adjacent to the array of beam controlled tiles with solderless DC connections being provided by an arrangement of 'fuzz button' electrical connector elements.