The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2006

Filed:

Dec. 18, 2002
Applicants:

Anteneh Kebbede, Albany, NY (US);

Bernard P. Bewlay, Schenectady, NY (US);

James A. Brewer, Scotia, NY (US);

Sylvain S. Coulombe, N-D lle-Perrot, CA;

Sylvia M. Decarr, Schenectady, NY (US);

Luana E. Iorlo, Clifton Park, NY (US);

Timothy J. Sommerer, Ballston Spa, NY (US);

James S. Vartuli, Rexford, NY (US);

Inventors:

Anteneh Kebbede, Albany, NY (US);

Bernard P. Bewlay, Schenectady, NY (US);

James A. Brewer, Scotia, NY (US);

Sylvain S. Coulombe, N-D lle-Perrot, CA;

Sylvia M. DeCarr, Schenectady, NY (US);

Luana E. Iorlo, Clifton Park, NY (US);

Timothy J. Sommerer, Ballston Spa, NY (US);

James S. Vartuli, Rexford, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 61/36 (2006.01); H01J 17/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hermetically sealed lamp having at least one end-to-end seal. The end-to-end seal may be a material diffusion bond, a seal-material bond, or any other suitable bond. For example, the hermetically sealed lamp may have one or more endcaps butt-sealed to an arc envelope, such as a ceramic tube or bulb. The hermetically sealed lamp also may have one or more tubular structures, such as dosing tubes, which are butt-sealed to the endcap and/or arc envelope. Localized heating, such as the heat provided by an intense laser, also may be used to enhance any of the foregoing bonds.


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